Please tell us a bit about Dialog and why you were at Sensors Expo
Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today’s leading mobile devices and the enabling element for increasing performance and productivity on the go.
Dialog attended Sensors Expo 2018 to launch its new 15 Degrees-of-Freedom (DOF) SmartBond™ Multi-Sensor Kit to support sensor connectivity in the Internet of Things (IoT).
Were you showcasing a particular product or service?
Yes. Dialog showcased and demoed its new 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit. The new sensor kit is built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), and allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.
The Sensor Kit offers engineers and educational institutions a comprehensive sensor solution, with flexibility across hardware and software that includes extensive cloud support ranging from IFTTT for the creation of simple applets, to the creation of advanced workflows for data analytics supporting cloud agents from all major platforms including Amazon Web Services (AWS) and Microsoft Azure.
What makes your products unique?
Dialog’s SmartBond™ product family specifically is the simplest route to delivering the most power-friendly and flexible Bluetooth connected products to the market. The entire product family delivers the smallest, most power efficient Bluetooth low energy solutions available - and enables the lowest system costs.
What application areas do your products cover?
Smart Home, Automotive, Home Appliances, Wearables, Smart Lighting and Smart Meters, just to name a few.
What were you hoping to get out of the conference?
Dialog attended the expo primarily to launch the new sensor kit and raise awareness for its key benefits for engineers. Dialog wanted to promote the fact that the kit supports more sensors than any other on the market, and it allows developers to collect environmental data including temperature, pressure, humidity, gas concentrations, as well as motion, light, sound and magnetic field. This broad capability is especially suited to projects that require rapid prototyping and accelerated time-to-market.