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Michael Davis, Principal Engineer at Hutchinson Technology, spoke to AZoSensors about Hutchinson Technology's expertise and their attendance at TDK's Developers Conference.
Please tell us a bit about Hutchinson Technology Inc.
Hutchinson Technology Inc is a high-volume manufacturer of precision electromechanical components and assemblies.
What kind of application areas do Hutchinson’s sensor products have?
Our applications include strain gauges, temperature sensors, wireless communication coils, wireless power transmission, proximity sensors, and actuators. We specialize in small form factor products for consumer electronics, medical devices, industrial, and other markets.
What makes them unique in the marketplace?
Hutchinson Technology offers a wide breadth of process technologies that allow our customers to open up their design window. We provide a toolbox for customers to shrink their form factor, improve performance, and simplify their supply chain by integrating multiple functions into a single component.
Sensors can now have an incredibly small footprint. How else do you think they will continue to develop in the future?
In addition to shrinking footprint, there is a trend toward packing more functionality into existing devices. For example, we now have a product integrating both a strain gauge and a wireless connector for product validation into a single component.
What can attendees at TDK’s Developer Conference expect from your speaker session?
Our topic is miniaturized solutions for the Internet of Things. We will discuss how integrating sensors and wireless communication with flexible circuitry can enable smaller form factor designs.
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