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New Partnership to Develop Ultra-low Power Always-on Face Activation Solution Targeting Mobile Devices

CEVA, Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Visidon, Ltd., a developer of industry-leading facial recognition technologies for mobile and embedded platforms, today announced that the companies have partnered to develop an ultra-low power, 'always-on' face activation solution targeting mobile devices.

From Visidon 17 Feb 2014

STMicroelectronics Releases its Teseo II Single-Chip Satellite-Tracking IC for eCall Approval

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronic applications, today announced that it had released its Teseo II single-chip satellite-tracking IC to the European Space Agency (ESA) and the European Commission Joint Research Center (JRC) for testing for eCall approval.

From STMicroelectronics 14 Feb 2014

ROHM Semiconductor's Operational Amplifiers Enable Improved Signal Processing Accuracy

ROHM Semiconductor today introduced the development of the BD5291G and the BD5291FVE low voltage, low offset operational amplifiers (opamp) designed to amplify signals from motion sensors such as accelerometers and gyroscopes.

From ROHM Co., Ltd. 14 Feb 2014

CEA-Leti and STMicroelectronics Demonstrate 28nm UTBB FD-SOI Technology-Based UWVR DSP

CEA-Leti and STMicroelectronics presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology.

From STMicroelectronics 13 Feb 2014

Northrop Grumman Provides Update on Scalable Agile Beam Radar at Singapore Air Show

Northrop Grumman Corporation's Scalable Agile Beam Radar (SABR) will help bring advanced capabilities to existing global F-16 fleets, keeping them formidable beyond 2025, according to the head of the company's Combat Avionics Systems business unit.

From Northrop Grumman Corporation 13 Feb 2014

NSF Awards Lehigh Assistant Professor CAREER Award to Develop Mobile Sensor Technology for Structural Condition Assessment

Shamim Pakzad, an assistant professor of structural engineering in the department of civil and environmental engineering, has received a five-year CAREER Award from the National Science Foundation (NSF) to support his research on the development of mobile sensor technology for structural condition assessment.

13 Feb 2014

E2S Warning Signals Offers Five Year Warranty for Signalling Products

For greater peace of mind, signalling products for hazardous areas, fire and industrial applications and wide area disaster warning are now available with a five-year warranty.

12 Feb 2014

Leading Defense Prime Contractor Places Order for Mercury Systems’ High-Performance DSP Modules

Mercury Systems, Inc. (mrcy.com), a best-of-breed provider of commercially developed, open sensor and Big Data processing systems for critical commercial, defense and intelligence applications, announced it received $3.1 million in new orders from a leading defense prime contractor for high performance, digital signal processing modules for an unmanned airborne signals intelligence (SIGINT) application. The orders were booked and shipped in Mercury's fiscal 2014 second quarter.

11 Feb 2014

New Low-Power Signal-Processing Chip Shows Promise for Cochlear Implants Without External Hardware

Cochlear implants — medical devices that electrically stimulate the auditory nerve — have granted at least limited hearing to hundreds of thousands of people worldwide who otherwise would be totally deaf.

10 Feb 2014

SMARTRAC’s RFID and NFC Technologies to be Distributed by Avnet

Avnet Electronics Marketing Americas, a business region of Avnet, Inc., has entered a distribution agreement with SMARTRAC N.V., a leading developer, manufacturer and supplier of radio-frequency identification (RFID) and near field communications (NFC) transponders, tags and inlays.

From Avnet, Inc. 7 Feb 2014

Signal Processing News

New Partnership to Develop Ultra-low Power Always-on Face Activation Solution Targeting Mobile Devices

STMicroelectronics Releases its Teseo II Single-Chip Satellite-Tracking IC for eCall Approval

ROHM Semiconductor's Operational Amplifiers Enable Improved Signal Processing Accuracy

CEA-Leti and STMicroelectronics Demonstrate 28nm UTBB FD-SOI Technology-Based UWVR DSP

Northrop Grumman Provides Update on Scalable Agile Beam Radar at Singapore Air Show

NSF Awards Lehigh Assistant Professor CAREER Award to Develop Mobile Sensor Technology for Structural Condition Assessment

E2S Warning Signals Offers Five Year Warranty for Signalling Products

Leading Defense Prime Contractor Places Order for Mercury Systems’ High-Performance DSP Modules

New Low-Power Signal-Processing Chip Shows Promise for Cochlear Implants Without External Hardware

SMARTRAC’s RFID and NFC Technologies to be Distributed by Avnet

Advancing Battery Safety and Electrification: Insights from Sensata Technologies

The Instrumental Role of MEMS Pressure Sensors in Water Conservation

Tag Talk: The Future of RFID and IoT Technologies at Beontag

Multipurpose Beam Load Cells for Weighing

EasyMax 402 Calorimeter

GFP400 for Circuit Protection

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