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Cadence Tensilica HiFi Audio/Voice DSP Selected by VIA Technologies for SOC Design

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Taiwan-based VIA Technologies has selected the Cadence® Tensilica® HiFi Audio/Voice DSP (digital signal processor) for a system-on-chip (SOC) design for set top box, tablets and mobile devices.

22 Oct 2013

RFMD’s 1.2 GHz Power Doubler Amplifier Supports New DOCSIS 3.1 Cable Specification

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, today unveiled its first power doubler amplifier in a multi-chip module to support the requirements of the new data over cable service interface specification (DOCSIS) 3.1.

21 Oct 2013

ABB Commissions High-Performance Wireless Broadband Network for City of Venice

ABB, the leading power and automation technology group, has commissioned a high-performance wireless broadband network for the city of Venice, Italy. The network provides free Internet access for residents and businesses and (for a small fee) the 22 million tourists who visit the city every year. The contract was awarded by the Municipality of Venice.

19 Oct 2013

Deep-Sea Wireless Network Being Developed by UB Researchers

Wireless networks span the globe. But like a frightened toddler, they don’t go underwater.

19 Oct 2013

Toshiba’s New IC Includes SPP and GATT to Support Bluetooth v4.0

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today launches its TC35661SBG-501, a new device that includes the Serial Port Profile (SPP) and Generic Attribute Profile (GATT) to support the Bluetooth® v4.0 communications standard.

From Toshiba America, Inc. 19 Oct 2013

ISEE Launches OMAP5432-Based IGEPv5 Embedded Processor Development Board

The new IGEPv5 is an embedded processor development board based on Texas Instruments OMAP5432 Multimedia Application Device. The OMAP processor is designed to support high performance applications within a low power envelope, preventing the need for fans.

18 Oct 2013

Northrop Grumman to Highlight CIRCM and Radar-Warning Receiver Systems at AUSA

Northrop Grumman Corporation, a leader in global security, will be highlighting its most significant advances in developing, producing and modernizing U.S. military systems and related electronic technologies at the Association of the United States Army (AUSA) Annual Meeting and Exposition, taking place Oct. 21-23 at the Walter E. Washington Convention Center in Washington, D.C.

From Northrop Grumman Corporation 18 Oct 2013

Ruckus Wireless Names ScanSource as 2013 North American Distributor of the Year

ScanSource®, Inc., the leading international value-added distributor of specialty technology products, has been named 2013 North American Distributor of the Year by Ruckus Wireless, Inc., a global supplier of advanced wireless systems for the rapidly expanding mobile Internet infrastructure market.

17 Oct 2013

Access Network Discovery and Selection Function Will Enable Truly Seamless Mobility

Smith Micro Software, Inc., a leading provider of wireless and mobility solutions, today announced it will lead two educational sessions on emerging industry standards at GSMA North America (GSMANA), October 14-16 in Vancouver, B.C. Spanning more than 220 countries, the GSMA represents the interests of mobile operators worldwide, and Smith Micro has been an active member in GSMA since 2009.

17 Oct 2013

Raytheon Demonstrates Affordable Protected Tactical Solution Using Unclassified, Secure Waveform

Raytheon Company, whose terminals protect the military's most sensitive satellite communications, recently held a demonstration that proved sensitive data could be passed through small, low-cost satellite terminals using an unclassified but secure waveform.

From Raytheon Company 17 Oct 2013

Signal Processing News

Cadence Tensilica HiFi Audio/Voice DSP Selected by VIA Technologies for SOC Design

RFMD’s 1.2 GHz Power Doubler Amplifier Supports New DOCSIS 3.1 Cable Specification

ABB Commissions High-Performance Wireless Broadband Network for City of Venice

Deep-Sea Wireless Network Being Developed by UB Researchers

Toshiba’s New IC Includes SPP and GATT to Support Bluetooth v4.0

ISEE Launches OMAP5432-Based IGEPv5 Embedded Processor Development Board

Northrop Grumman to Highlight CIRCM and Radar-Warning Receiver Systems at AUSA

Ruckus Wireless Names ScanSource as 2013 North American Distributor of the Year

Access Network Discovery and Selection Function Will Enable Truly Seamless Mobility

Raytheon Demonstrates Affordable Protected Tactical Solution Using Unclassified, Secure Waveform

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