Corning Incorporated's Telecommunications segment today announced it will showcase its full suite of wireless products at Mobile World Congress in Barcelona, Spain, February 25-28. Corning will highlight how its multi-operator, multi-service distributed antenna systems (DAS), fiber connectivity and fiber-to-the-antenna (FTTA) solutions cost-effectively and efficiently enhance wireless services.
Tensilica®, Inc. today announced that it will showcase its complete hardware/software intellectual property (IP) solutions that are leading the market in audio, voice, video, imaging and baseband communications at stand 6D101 at the Mobile World Congress, February 25-28, 2013, in Barcelona, Spain.
Jasper Wireless, the leading connected devices platform for machine-to-machine (M2M) and consumer electronics, today announced an agreement with Claro Brazil to wirelessly connect machine-to-machine (M2M) and consumer electronics devices in Brazil.
Cypress Semiconductor Corp. today announced that Electronic Products magazine has named the PRoC™-UI (Programmable Radio-on-a-Chip–User Interface) a 2012 Product of the Year. The PRoC-UI solution combines a 2.4-GHz proprietary WirelessUSB™-NL Radio with Cypress’s CapSense® and TrueTouch® capacitive touch technologies. This combination enables user interface functionality in wireless devices, including gestures supported by Windows 8 applications. Cypress also announced that three variations of the PRoC-UI family are now in production.
Our digitized world of instant communication is enabled by the transfer of high-speed signals across many systems within a device. As modern signal speeds are pushed to quickly accommodate gigabytes of data, disturbances that were once considered minor, such as weather changes, now become more serious, with the potential to stop systems and corrupt data.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance audio ICs, together with Soundchip, a Swiss-based innovator in audio-systems technology and originator of the High-Definition-Personal-Audio™ (HD-PA®) Reference, today introduced two HD-PA audio engines, STANC0 and STANC1, and an HD-PA microphone, the MP34AB01H, which enable the creation of exciting, feature rich, software-controlled smart audio accessories.
Imec, in collaboration with Panasonic Corporation (Japan), has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60GHz radio transceiver chipset with low power consumption, that delivers high data rates over short distances. Imec drastically boosted the link budget of the system by introducing beamforming into the radio architecture. This multi-Gbit 60GHz chipset paves the way toward small size, low-power, low-cost, high-data rate solutions for battery-operated consumer devices, such as smart phones and tablets.
NXP Semiconductors N.V. today introduced GloTOP 2.5G, the latest addition to the company's ATOP family of telematics solutions. GloTOP is an automotive telematics module specifically designed to work with the Russian GLONASS satellite navigation system. Featuring a parallel reception system for both GLONASS and GPS, GloTOP is able to automatically select the most optimal signal at any one time to always ensure the most accurate positioning. It also enables the quick and easy integration of telematics applications in vehicles accessing this satellite system.
Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus.
Cypress Semiconductor Corp. today announced that Net Vision Co., Ltd. has designed Cypress’s EZ-USB® FX3™ USB 3.0 device controller into its SVI-06 Image Recorder. The SVI-06 Image Recorder board connects to almost any CMOS image sensor, providing a complete development support kit for high-definition inspection equipment. With the FX3 solution’s USB 3.0 bandwidth, the SVI-06 can connect with two image sensors at once, enabling simplified development of applications with precise 3D inspection functionality.
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