Light / Image Sensor News

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IDS 2015: Teledyne DALSA to Showcase Low Dose, CMOS Digital X-ray Detectors

Teledyne DALSA, a Teledyne Technologies company and global leader in digital X-Ray image sensing technology, will showcase its low dose, CMOS digital X-Ray detectors at the upcoming 36th International Dental Show (IDS). The fair will be held March 10-14 at the Kölnmesse in Cologne, Germany. Teledyne DALSA will be located in Hall 2.2 Stand B59.

6 Mar 2015

TowerJazz Commences Mass Production of IR Sensor for Intel’s 3D Sensing Solutions

TowerJazz, the global specialty foundry leader, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions. Intel chose TowerJazz's CMOS image sensor (CIS) platform, specifically its unique IS11 process, due to its unparalleled pixel performance at near infrared light with very high speed, high quantum efficiency (QE) and high optical resolution.

5 Mar 2015

Samsung Introduces New 8MP ISOCELL RWB CMOS Image Sensor and Near Field Communication IC

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced new cutting-edge mobile component solutions that advance users’ mobile experiences. These solutions include an 8-megapixel (MP) RWB (Red-White-Blue) image sensor based on ISOCELL technology and an NFC (Near Field Communication) integrated circuit (IC) with improved RF (Radio Frequency) performance.

5 Mar 2015

Toshiba Introduces 13MP CMOS Image Sensor for Smartphones and Tablets

Toshiba Corporation today announced the launch of "T4KB3", a 13 megapixel BSI CMOS image sensor with the optical format of 1/3.07 inch for smartphones and tablets. Sample shipments start today.

4 Mar 2015

Cypress and IDEX Debut Fingerprint User Authentication Solution for Smartphones

Cypress Semiconductor Corp., in conjunction with its strategic partner IDEX ASA, today introduced a fingerprint reader solution designed to bring reliable, easy-to-use user authentication to smartphones, tablets, wearables and other mobile devices.

4 Mar 2015

OmniVision Introduces OV16880 16MP Image Sensor Based on PureCel-S™ Stacked Die Technology

OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV16880, a new 16-megapixel image sensor built on OmniVision's PureCel-S™ stacked die technology.

From OmniVision Technologies, Inc. 4 Mar 2015

Raytheon Delivers Second Visible Infrared Imaging Radiometer Suite Instrument for Joint Polar Satellite System Mission

Raytheon Company delivered a second Visible Infrared Imaging Radiometer Suite (VIIRS) instrument to support the National Oceanic and Atmospheric Administration's (NOAA) Joint Polar Satellite System mission.

4 Mar 2015

Infinity Augmented Reality Honored with 2015 European Frost & Sullivan Award for Technology Innovation Leadership

Based on its recent analysis of the augmented reality application developer engines market, Frost & Sullivan recognizes Infinity Augmented Reality, Inc. (InfinityAR) with the 2015 European Frost & Sullivan Award for Technology Innovation Leadership.

4 Mar 2015

HGH Infrared Systems Launches Spynel-M Thermal Camera for Critical Infrastructure Protection

Following the award-winning international success of their widely recognized line of panoramic IRST cameras, HGH Infrared Systems is proud to announce the launch of their latest Spynel model, the Spynel-M. With dimensions of less than 12x20cm and weight of only 1.8 kg, the Spynel-M is a cost-effective, rugged, and compact solution for wide area surveillance. One single Spynel-M sensor effectively replaces up to 16 traditional cameras and is able to perform 24/7 early human intrusion alerts over a 1.5 km-diameter area.

2 Mar 2015

SMIC, Cista System Achieve Mass Production for Two CIS-BSI Technology Products

Semiconductor Manufacturing International Corporation ("SMIC") the largest and most advanced pure-play foundry provider in China, and Cista System Corp. a fabless semiconductor company that specializes in CMOS Image Sensors (CIS) and System on Chip (SoC) designs, have jointly announced the achievement of mass production for two CIS-BSI products, of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel, respectively. Both sensors are based on SMIC's independently developed 0.13-micron BSI technology platform.

2 Mar 2015

Light / Image Sensor News

IDS 2015: Teledyne DALSA to Showcase Low Dose, CMOS Digital X-ray Detectors

TowerJazz Commences Mass Production of IR Sensor for Intel’s 3D Sensing Solutions

Samsung Introduces New 8MP ISOCELL RWB CMOS Image Sensor and Near Field Communication IC

Toshiba Introduces 13MP CMOS Image Sensor for Smartphones and Tablets

Cypress and IDEX Debut Fingerprint User Authentication Solution for Smartphones

OmniVision Introduces OV16880 16MP Image Sensor Based on PureCel-S™ Stacked Die Technology

Raytheon Delivers Second Visible Infrared Imaging Radiometer Suite Instrument for Joint Polar Satellite System Mission

Infinity Augmented Reality Honored with 2015 European Frost & Sullivan Award for Technology Innovation Leadership

HGH Infrared Systems Launches Spynel-M Thermal Camera for Critical Infrastructure Protection

SMIC, Cista System Achieve Mass Production for Two CIS-BSI Technology Products

Advancing Battery Safety and Electrification: Insights from Sensata Technologies

The Instrumental Role of MEMS Pressure Sensors in Water Conservation

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