Today, at the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing.
After analyzing the different home security systems available on the market, the team at TopSecuritySystems.net has posted detailed reviews of the top 5 home security companies.
TeleCommunication Systems, Inc. (TCS), a world leader in highly reliable and secure mobile communication technology, today announced the availability of its X/Y Tracking Antenna Systems. These precision systems are specifically designed for low-Earth orbit (LEO) and medium-Earth orbit (MEO) satellites in support of Earth observation, remote sensing, and telemetry, tracking and control applications. Initial orders are now shipping to small satellite operators that are offering a cost-effective and pervasive earth observation data solution.
Epson Electronics America (EEA), the world leader in compact, high-performance QMEMS Inertial Measurement Units (IMUs), announced today a strategic partnership with Geodetics Incorporated of San Diego, California for production of a new variant of the Geo-iNAV™ product to enhance each other’s customer reach, sales channels, products and technology.
BinMaster introduces the glass bob sensor, which is specifically designed for measuring the level of silica sand, commonly referred to as frac sand, in bins, tanks or silos.
Garmin International Inc., a unit of Garmin Ltd., the global leader in satellite navigation, today announced the GPSMAP 64 series of rugged outdoor handhelds. The GPSMAP 64 series brings a dual GPS and GLONASS receiver, preloaded geocaches and smartphone connectivity for LiveTrack and Smart Notification to a product line already popular with hunters, hikers and geocachers of all ages.
Bosch is fully committed to developing the world of connected, intelligent devices – a global market that Gartner predicts will reach US$1.9 trillion by 2020.1 Tapping into this enormous market – which Bosch calls “the Internet of Things and Services” (IoTS) – at the 2014 International CES® is no easy feat, but Bosch is uniquely positioned to achieve success: It designs and manufactures the world’s broadest portfolio of micro-electromechanical systems (MEMS), the building blocks of the IoTS.
SoftKinetic®, the world's leading provider of 3D depth sensing and gesture recognition solutions, today announced that SoftKinetic's DepthSense® 3D Time-of-Flight (ToF) USB camera and iisu® gesture recognition middleware have been integrated with the NVIDIA® Tegra® NOTE 7 tablet platform, and the platform is available to developers to create 3D depth sensor-enabled applications for the mobile world.
GreenPeak Technologies, the rapidly growing Smart Home radio communications semiconductor company, confirms its market leadership selling about 1 million chips per week for a wide variety of sense and control applications into the Smart Home market worldwide.
Polar, the leader in heart rate monitoring and fitness assessment technologies, today unveiled the Polar V800, the smartest and most advanced training computer designed for many different sports and athletic endeavors. The Polar V800 features integrated GPS and 24/7 activity tracking with customizable multisport profiles.
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