Micro displacement measurement at the submicron and nanometer level is the primary application for non-contact capacitive sensors and eddy-current sensors. To help engineers and other users make those measurements with the best possible results, Lion Precision has expanded its growing technical library to include application notes on linear displacment measurements and position measurements for each sensor technology.
Peratech, the innovator in touch technology, has announced that it is working with The Centre for Process Innovation (CPI) to develop new formulations for its award-winning QTC™ materials; the work is supported by government funding as a R&D Technology Strategy Board (TSB) project.
Selex ES, a Finmeccanica company, is attending LAAD 2013, taking place in Rio de Janeiro, from 9th to 12th April 2013, showcasing its products within the Finmeccanica stands in the aerospace area - hall 4, stand G30-, in the Army area - hall 3, stand P48 –, in the naval area - hall 2, stand X16 - and in the outdoor static exhibition, in stand 40, by displaying a number of products which range from airborne to land and naval applications. During the exhibition the company will also introduce a Light ISR system.
SWINDON Silicon Systems, a global leader in high quality, high performance mixed signal Application Specific Integrated Circuits (ASICs), announces a new partnership with Redtree Solutions Ltd, a manufacturers’ representative organization covering the EMEA (European, Middle-Eastern and African) markets.
Advanced Photonix®, the leading supplier of terahertz systems to industry, announced today that it has sold a T-Gauge® terahertz sensor to Shanghai Gaojing in Shanghai, China. The system, equipped with a high-speed line scanner, will be integrated into a new security platform being developed as part of a major national program for security instrumentation.
According to a new market research report "Millimeter Wave (MM Wave) Market - By Technology, Components (Frequency, Imaging, Radio); Products (MM Scanners, MM RADARs, MM Macro/Small Cell Backhaul); Applications (Telecommunication, Healthcare, Automotive)-Analysis & Forecast (2013 - 2018)". Published by MarketsandMarkets, Inc., the total market is expected to reach roughly $1.2 billion by 2018, growing at an explosive CAGR of 59.10% for the period of 2013 to 2018.
Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores, announced today that the Company's 1T-OTP macros for TSMC's 180nm BCD 1.8/5V/HV and G 1.8/5V processes have met all of TSMC's IP9000 Assessment program requirements.
(Family Features) Each season brings new threats to the safety of your home and family. In 2012, the U.S. experienced multiple major weather events including Hurricane Sandy. This year is likely to be no different. Be prepared by following these simple tips to avoid the devastation caused by home fires, break-ins and weather-related disasters.
EmiSense Technologies, LLC today announced it has closed its third round of funding. The investment round was led by strategic investor 9th Street Investments. EmiSense will use the US $6.5M in new funding to launch products, continue research and development, and support validation testing with global customers.
The Chinese sensor contract manufacturing and export market had taken a hit from the European debt crisis but managed to stay buoyant due to the strong domestic demand from the automotive, consumer electronics and process industries. The Government's initiatives and stimulus packages aimed at stoking local demand will further assist market growth.
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