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Teledyne DALSA Semiconductor’s Advanced MEMS Prototyping and Production Featured at EU MEMS & Sensors Summit 2017

Sep 12 2017

Image Credits: Teledyne DALSA

Teledyne DALSA Semiconductor, a global leader in MEMS contract manufacturing, including optical and imaging MEMS technologies, is sponsoring and exhibiting at SEMI’s European MEMS & Sensors Summit 2017.

As one of the world’s foremost pure-play MEMS foundries, Teledyne DALSA Semiconductor offers advanced MEMS technologies and high-volume manufacturing on both 150 and 200 mm wafers, delivering a complete solution from prototype to mass production. A comprehensive MEMS toolbox allows the development and mass production of a wide range of sensors and actuators, including micro-mirrors, micro-bolometers, pressure sensors, microphones, inertial sensors, micro-fluidics, and oscillators. Many of the device types manufactured by Teledyne DALSA include wafer-level packaging or through-silicon-via (TSV) technology, which enables advanced packaging solutions and opens new markets for MEMS.

The Summit takes place September 20-22, at the MINATEC Conference Center in Grenoble, France.

Where: European MEMS & Sensors Summit 2017, Booth #30

MINATEC Conference Center, Grenoble, France

When: Wednesday, September 20 – Friday, September 22

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