Epson has developed an oven-controlled crystal oscillator (OCXO) 'OG7050CAN' that consumes 56% less power than the products in Epson's earlier OG1409 series ("earlier products"). Measuring 7.0 × 5.0 mm and with a height of 3.3 mm (Typ.), the new OCXO is 85% smaller than earlier products by cubic volume.
New product OG7050CAN. Image Credit: Epson
Reference signal sources in wired and wireless backbone communication facilities such as base stations and data centres are subject to strict accuracy and stability criteria. Oven-controlled crystal oscillators are used as a reference signal source in such applications because of their high stability. The crystal oscillator is enclosed in a temperature-controlled chamber ("oven") . The temperature inside the oven is held constant even when the ambient temperature changes, thereby minimizing frequency drift.
Communication data traffic continues to grow, propelled by the roll-out of 5th generation communication systems (5G), the spread of the Internet of Things (IoT), the use of artificial intelligence (AI) in data centres, and the upcoming 6G services. These changes are expected to cause power consumption at base stations and data centres to sharply increase and drive demand for low-power OCXOs used as reference signal sources.
To meet this demand, Epson drew on its crystal device, semiconductor, and mounting technologies to develop an OCXO that consumes 56% less power and is 85% smaller than earlier products.
This improvement was enabled in large part by the miniaturization of the oven and the stress compensated (SC) cut crystal unit.
Unlike AT-cut crystal units used in ordinary crystal oscillators, SC-cut crystal units are highly stable and resistant to thermal shock and vibration. Earlier products employed a circular SC-cut crystal unit with a diameter of 6 mm, requiring a large oven and a large amount of power to maintain a constant temperature.
To solve this problem, Epson redesigned the crystal unit, using a rectangular structure instead of a circular one. Not only did they succeed in reducing the size of the SC-cut crystal unit by 90%, they did so while improving performance and reducing power consumption. The redesign also reduced the cubic volume of the oven by 96% compared to the earlier products.
Another challenge the developers faced was to achieve a low-power oven structure. Epson developed and optimized its own oscillator IC and heater IC to hold the SC-cut crystal unit in the oven at a constant temperature while minimizing power consumption. The oven is bonded inside the OCXO package with an adhesive that has low thermal conductivity to improve internal insulation.
This limits the loss of heat from the heater IC and keeps power consumption low. By using a digital means of controlling the temperature of the SC-cut crystal unit instead of the conventional analogue method, the developers were able to keep the crystal unit's temperature more stable even when the ambient temperature fluctuates, reducing the frequency/temperature characteristics of the OCXO from ±50 × 10-9 to ±3 × 10-9.
These developments have resulted in a highly accurate OCXO that consumes 56% less power (0.2 W at 25 ℃) than the earlier products and is 85% smaller (7.0 × 5.0 mm size). This reduction in power consumption enables the temperature of the SC-cut crystal unit to stabilize faster, reducing frequency stability at startup by a factor of 5 or more compared to the earlier products.
As a leader in crystal devices, Epson will continue to provide crystal device products that meet the needs of all manner of electronic devices and social infrastructure.
New Product Features
- Low power consumption: 0.2 W at 25 ℃ (still air)
- Small size: 7.0 × 5.0 × 3.3 mm, Typ.
- Frequency/temperature characteristics: ±3 × 10-9
- Startup time until Frequency stabilizes to within ±20 × 10-9:30 s.
- A PLL5 function allows the output frequency to be set anywhere from 1 MHz to 170 MHz through internal IC settings.
- A jitter reduction function controls PLL induced noise deterioration.
Samples of the new OCXO will be available from April 2025.