CyberOptics and Viscom have joined hands to come up with leading edge technology for 3D SPI sensors.
The intent of this development and supply agreement is to integrate CyberOptics SE500 sensor onto the Viscom inspection platform. They plan to unveil the 3D SPI sensor at the IPC APEX 2011 in Las Vegas, the SMT show in Nuremburg and Nepcon at Shanghai.
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CyberOptics is a leading player in the SMT market having sold over 3000 3D SPI systems. And Viscom has provided several thousand AOI and AXI solutions to customers worldwide. In the 25 years of market presence, Viscom has catered to the automotive and industrial electronics market. With Viscom and CyberOptics coming together to combine their technologies, the increasing demand for high-end 3D SPI will be met to a great extent.
These two players have mutual benefits out of this agreement. By working with CyberOptics Viscom gets the advantage of high speed three-dimensional solder paste inspection system thereby opening new segments in the market. Volker Pape, co-founder of Viscom is extremely positive that this cooperation is a perfect matching solution and will aid Viscom in meeting the high demand for their products.
Kitty Iverson, CEO of CyberOptics feels that through this partnership they are able to connect directly to the customers in the SMT market. He sees this partnership as a significant step towards enabling CyberOptics to resurface as an innovative leader in the SMT market.
Peter Krippner, who heads the Viscom product Division briefed about the integration process thus. The integration work begun by using ViscomS3088 SPI sensor with the CyberOptics SE500.This was completed quickly and smoothly as the Viscom software was comprehensive and had the entire features essential to evaluate the 3D sensor signal. In less than three months they were able to design a fully running prototype. Fully satisfied with the initial results, Peter and his team plan are looking at having the production roll out during June2011 timeframe.