Joint Project to Illustrate First Integrated Printed Sensor Circuitry

PARC, a Xerox company, declared that it has received a 12-month contract from the FlexTech Alliance to create lightweight, versatile printed integrated sensor systems with logic and memory.

PARC will work with Thin Film Electronics and UC Berkeley for this contract. The initial project will focus on calculating temperature and blood oxygen content, followed by monitoring pressure, humidity, light, gas, and sound, using printed sensing platforms.

These sensors can be effectively deployed in pharmaceuticals tags for detecting and tracking temperature while shipping, radiation tags, disposable medical sensors, and food tags for identifying spoilage and contamination.

According to PARC program manager responsible for FlexTech Alliance contract, Janos Veres, printed electronics has been promoted to the next level ‘systems integration’, through this contract. The team comprising PARC, Thinfilm and UC Berkeley has developed a large number of printed electronics circuits and components, relying on the compatibility between components for developing whole systems. Printed sensors can be advanced through extensive measuring and recording capabilities.

With more than 10 years of expertise in printed electronics device design and prototyping, PARC will complement its project with a wide range of printed electronics circuit and device libraries. PARC has capitalized on several materials and device types such as batteries, transistors, sensors and memories. It also targets ink-jet printed field-effect transistors for complementary circuitry, and development of integrated printed electronic systems. PARC and Thinfilm recently described a printed addressing circuit for printed memory.

Projects funded by the FlexTech Alliance are scrutinized by the FlexTech Technical Council.

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