By Kalwinder KaurAug 29 2012
Coherix, a provider of advanced vision measurement and inspection solutions for production, has launched its latest sensor ‘OPIS’ for electronics and semiconductor markets.
OPIS (Optical Precising Inspection System) is a compact system, wherein on-the-fly location and assessment capability in high definition has been integrated with the supplementary advantages of processing multiple parts concurrently, contributing to the achievement of substantially high throughput.
According to Coherix Director of Application Engineering, Jon Upham, Coherix has been delivering high-performance, on-the-fly, three-dimensional positioning and inspection systems to semiconductor customers since five years. OPIS was designed and developed for the same capability in two dimensional in response to its customers. The lighting and control technology from the company’s 3DX range of inspection systems, was integrated within a compact, affordable package to create OPIS.
OPIS is available in multiple fields of resolution, view, precision and speed configurations. It examines Leaded (QFP, TSOP), ball grid array (BGA), and Leadless (QFN) components having zero mechanical changeover between components. Coherix’s OPIS systems are now being shipped to OEM customers.
Coherix is a private, worldwide provider of 2-D inspection solutions and high-speed, high-definition 3-D visualization systems that enhance the production processes. Based in Ann Arbor, Coherix has its technical centers operating in the Asia-Pacific region and Europe. Coherix products are being deployed worldwide at companies like General Motors, Intel, SPIL, BorgWarner, KYEC, Ford, Honda, MAG, John Deere, Volvo Technology Transfer, Chrysler, Micron, TRW, and Infineon, to name a few.
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