Mar 19 2010
Sensonor Technologies will present some of its developments in the design and fabrication domain at the SPIE Defense, Security, and Sensing (DSS) conference in Orlando, Florida, U.S. on 5 to 9 April 2010.
Sensonor Thermal Imaging
Currently Sensonor is working on manufacturing uncooled IR sensors for use in thermal imaging cameras.
During the conference, Sensonor’s Senior Engineer Dr. Adriana Lapadatu will deliver a talk titled ‘High-performance long wave infrared bolometer fabricated by wafer bonding’. Lapadatu has revealed that Sensonor is developing a novel microbolometer that has a peak responsitivity feature at the long wave IR range of electromagnetic radiation. Lapadatu has said that the microbolometer consists of a focal plane pixel arrays with a pitch of 25µm based on an IR sensitive material, that is, monocrystalline Si/SiGe quantum wells.
Lapadatu has further explained that a proper selection of several key processes and materials has resulted in the provision of enhanced absorption/transmission properties. Lapadatu has elaborated that these properties, along with the low 1/f noise from the thermistor material and high TCR, will result in increased performance of the microbolometer as compared to existing devices.