Jun 11 2010
The 3D Systems and Technologies division of Irvine Sensors Corporation has received new awards as well as add-ons for its ongoing contract, which totals to nearly $5.9 million.
The largest of the recent awards is for a new product that has leveraged the proprietary stacking technology for packaging an electronic system inside a very small cube. This product was created for a government application. The order empowers the government customer to provide funding for particular deliveries based on requirement.
Irvine Sensors has also received an order to deliver additional units of different types of a stacked chip product for use in another government application as well as a contract for further development of the proprietary microgyro of the company.
Irvine Sensors’ Chairman and CEO John Carson informed that such awards are the most recent illustrations of Irvine’s transformation of technologies into products. He added that Irvine has been accorded recognition to facilitate these transitions.