Sensor Tags Based on HF RFID Enabled Resistive Sensor IC

Melexis and Phase IV Engineering have collaboratively developed sensor tags that are based on the innovative MLX90129 HF RFID powered resistive sensor IC of Melexis. This collaborative effort will result in optimization of opportunities for deployment of this passive sensing chip for creating hitherto impossible sensing solutions.

As the inventors of the first commercial RFID sensing IC, Phase IV Engineering looks more of a competitor, rather than Melexis’ ideal partner. On the other hand, the MLX90129 chip has overtaken all current RFID sensing ICs, offering a data logging and RFID chip to Phase IV for solving sensing problems that were insolvable earlier.

The MLX90129’s powerful and distinctive features include ISO15693 standardized high frequency RFID interface, internal temperature sensor, configurability of a high degree for ensuring precision calibration, and two external very accurate differential inputs for accommodating broad range of sensor types.

For the battery-enabled data logging mode, the MLX90129 offers distinctive features that include a sealed sensor package, small size, expandable memory with the SPI interface, low thermal mass, data transfer and wireless configuration, and tethering any two types of external sensors, which include fast response temperature.

Phase IV Engineering’s COO Scott Dalgleish informed that the core competency of  Phase IV is to offer total sensing solutions for the embedded sensing and wireless problems that customers from a broad variety of industries bring to Phase IV. He explained that the MLX90129 helps Phase IV to provide effectively excellent solutions to various sensing projects that would not have been attended to by the company earlier. He revealed that the MLX90129’s enhanced features have opened up additional markets for the company.

Melexis’ RFID Product Marketing Manager Gilles Cerede added that Melexis is impressed with the ability of Phase IV to offer a total solution that encompasses sensor configuration, software, reader integration, calibration, and packaging.