Teledyne DALSA’s Semiconductor Foundry, a division of Teledyne Technologies, announced today the availability of its DH0485A Electrostatic Actuator High Voltage IC. Using proprietary High Voltage CMOS/DMOS technology, the DH0485A’s high accuracy, small footprint and low power is designed for portable systems containing MEMS Micro-Mirrors with up to 4 electrodes.
This device showcases Teledyne DALSA Semiconductor's suite of product development and manufacturing capabilities for MEMS/CCD/HV-CMOS solutions as required by ROADM, WSS, OXC and Integrable Tunable Lasers.
"Sophisticated High Voltage design permits us to electrostatically actuate one biaxial or two uni-axial MEMS Micro-Mirrors up to 240V" said Remi Meingan, Senior Product Manager. "With an internal DC to DC Boost Converter, a 16 Bit DAC with SPI Interface and advanced QFN Package, the DH0485A is the ideal solution for optical applications using MEMS Micro-Mirrors with 4 electrodes and needing accurate positioning.”
The DH0485A extends Teledyne DALSA's industry leading MEMS and MOEMS capability and provides a cost-effective solution for Optical MEMS. The DH0485A requires only a low voltage supply; the High Voltage Output is provided through a DC/DC Boost Converter up to 240V using an external miniaturized surface mount coil. The DH0485A is packaged in QFN 33L, 6x6mm, 0.5P and is ROHS compliant.
Key Features
- Four independent 16-bit High Voltage Amplifiers up to 240V
- 2-bit Voltage Selector pins allowing 90V, 115V, 170V and 240V Outputs, via a DC/DC Step-up Converter and Internal Loop Gain
- Standard SPI®/3-wire serial interface for DAC programming up to 50MHz
- Low Pass Filter to avoid resonance frequency of MEMS
- Low Noise
- Low Power Consumption
- Internal Diode for Temperature Monitoring
- Small footprint and Form Factor with QFN Package
DH0485A samples will be available in Q1 of 2014. To learn more, visit the product page or attend OFC/NFOEC 2014 where details will be presented regarding the DH0485A Electrostatic Actuator High Voltage IC for next-generation, high density, low power optical system requirements using MOEMS. More details will be available in Booth 4653.