Jul 8 2014
CyberOptics®Corporation, a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will showcase its most efficient and effective wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at SEMICON West 2014 in Booth #2511 at the Moscone Center, San Francisco, July 8-10.
CyberOptics will demonstrate the newly available ReticleSense Airborne Particle Sensor (APSR) which is an extension of the wafer-shaped WaferSense Airborne Particle Sensor (APS) line that has been adopted by major semiconductor fabs and OEM equipment makers worldwide.
To address the market demand for airborne particle measurement in 150mm semiconductor and gallium arsenide (GaAs) fabs in China, Europe, Japan, the U.S. and Taiwan, as well as LED fabs, CyberOptics also announced an extension of its APS line to include a 150mm wafer form factor.
With APS technology, equipment engineers can quickly and wirelessly monitor, identify and troubleshoot airborne particles in real-time within semiconductor process equipment and automated material handling systems. WaferSense and ReticleSense Airborne Particle Sensors enable equipment engineers to shorten equipment qualification, release to production and maintenance cycles all while reducing expenses. Customers have experienced up to 88% time savings, up to 95% reduction in costs, and up to 20X the throughput with half the manpower resource requirements using the WaferSense APS relative to legacy surface scan wafer methods.
“Minimizing airborne particles in the semiconductor industry and other markets operating under stringent manufacturing quality and productivity standards is critical. CyberOptics is delivering on our customers’ needs for airborne particle measurement in various form factors that help improve fab productivity while continuing to reduce costs,” said Subodh Kulkarni, President and CEO of CyberOptics.
Semiconductor fabs and OEMs value the accuracy, precision and versatility of the specialized WaferSense and ReticleSense measurement portfolio that enables improvements in fab yields and equipment uptime.