Sep 16 2014
CyberOptics®Corporation, a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will present at the upcoming SPIE Photomask Technology 2014, the premier worldwide technical meeting for the photomask industry, at the Monterey Marriott Hotel and Convention Center, September 16-18, 2014.
A panel session on Tuesday, September 16 at 4:35 p.m. will feature Allyn Jackson, Field Application Engineer for CyberOptics, discussing: “Improving Efficiency and Effectiveness of Processes Related to Airborne Particle Measurement in Reticle Mask Environments.”
“Minimizing airborne particles in photomask applications remains critical in semiconductor processes. Quickly identifying when and where airborne particles originate and the source of the contamination is challenging with traditional surface scan reticle, in-situ or hand-held methods. However, using a wireless, wafer-like and real-time particle counter results in compelling advantages in terms of time, expense and productivity,” said Allyn Jackson, Field Application Engineer.
Whether for equipment diagnostics, particle qualification or preventative maintenance, equipment engineers need to identify and troubleshoot airborne particle issues efficiently and effectively. Legacy methods are not real time, may cause long delays for results and are costly with downtime required to tear down the fab tool or run a series of test reticles. Without real-time-feedback, often ‘unexpected’ particle sources can also go undetected or take a long time to finally identify. Legacy methods can also lead to delays in equipment qualification, equipment release to production and maintenance cycles.
Lithography engineers can rely on CyberOptics ReticleSense proprietary technology, which is an extension of the proven WaferSense®wafer-shaped Airborne Particle Sensor (APS) device in use at semiconductor fabs worldwide including the three largest manufacturers where a contamination-free environment is critical.