Nov 27 2014
CyberOptics®Corporation, a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will demonstrate its wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at SEMICON Japan in Booth #4013 at Tokyo Big Sight, Tokyo, Japan Dec., 3-5, 2014.
To address the market demand for airborne particle measurement in 150mm semiconductor, gallium arsenide (GaAs), LED and flat panel display fabs, CyberOptics will also highlight the new WaferSense® Airborne Particle Sensor APS2 150C, its most recent extension of its APS line in a 150mm wafer form factor. The new APS2 150C incorporates advanced technology with a 60% increase in particle sensitivity at <10 false counts per hour.
“CyberOptics continues to help customers exceed manufacturing quality and productivity standards while improving equipment set-up, uptime and long term yields,” said Ferris Chen, Director of Sales, CyberOptics. “Semiconductor and Flat Panel Display fabs, as well as OEMs value the accuracy, efficiency and precision of the industry-leading wireless airborne particle sensor. Further increasing the particle sensitivity by 60% demonstrates our commitment to technology advancements that deliver even more value for our customers in terms of time and expense savings.”
With APS technology, equipment engineers can quickly and wirelessly monitor, identify and troubleshoot airborne particles in real-time within semiconductor process equipment and automated material handling systems. WaferSense and ReticleSense™ Airborne Particle Sensors enable equipment engineers to shorten equipment qualification, release to production and maintenance cycles all while reducing expenses. Customers have experienced up to 88% time savings, up to 95% reduction in costs, and up to 20X the through-put with half the manpower resource requirements using the WaferSense APS relative to legacy surface scan wafer methods. The advanced technology capabilities result in increased particle sensitivity further maximizing these key customer benefits.
CyberOptics will showcase the full suite of industry-leading wireless WaferSense measurement devices including the Airborne Particle Sensor (APS), Auto Vibration System (AVS), Auto Leveling System (ALS), Auto Teaching System (ATS) and the Auto Gapping System (AGS). The recently announced ReticleSense Airborne Particle Sensor (APSR) measurement device will also be featured.