IBM, STMicroelectronics and Shaspa today announced a collaboration to tap cloud and mobile computing for manufacturers and service providers to provide innovative ways for consumers to manage and interact with their homes’ functions and entertainment systems using multiple user interfaces such as voice recognition and physical gestures for a smarter home.
Lockheed Martin delivered the core structure for the first in a series of the National Oceanic and Atmospheric Administration (NOAA)’s next-generation geostationary weather satellites to the company’s Mississippi Space and Technology Center on NASA’s Stennis Space Center where it will undergo propulsion system integration.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Quantenna Communications, Inc., a leader in ultra-reliable Wi-Fi networking for whole-home entertainment, revealed today a Wi-Fi set-top box reference design platform to significantly accelerate wireless set-top box development by providing unparalleled flexibility, video quality and cost savings when deploying multi-room DVR (Digital Video Recorder) services.
The era of the smart, connected home that offers its occupants a greener, safer, more convenient and more enjoyable lifestyle has been brought closer through a unique collaboration announced today by STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Tatung, a leading electronics company for smart-home solutions. Working together, the two companies have developed an array of smart-home appliances that can be interconnected to form a smart-home ecosystem.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading producer of ICs for cable set-top boxes and home gateways, has revealed the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification.
Atmel® Corporation, a leader in microcontroller and touch technology solutions, today announced that Atmel® Corporation and Corning Incorporated (NYSE: GLW) are demonstrating Atmel XSense™ flexible sensor functionality on thin IT-sized and curved Corning Gorilla Glass form factors. These respective innovations will be showcased during the CES Unveiled and Digital Experience events. This work potentially enables innovative and cost-effective capacitive touch modules.
RDA Microelectronics ("RDA Microelectronics" or the "Company"), a fabless semiconductor company that designs, develops and markets wireless SoC and Radio Frequency (RF) semiconductors for cellular, connectivity and broadcast applications, today announced sampling of its RDA6821 and RDA6822 High Band WCDMA PA products for Band 1 (2100 MHz) and Band 2 (1900 MHz) applications. With the launch of these products, RDA now provides a complete 3G WCDMA PA offering for emerging markets.
Texas Instruments Incorporated (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications, today announced the full availability of a new ZigBee® BoosterPack based on TI's CC2530 ZigBee system-on-chip (SoC) that enables developers to jumpstart their designs.
As a result of efforts to develop relationships with other Alliances globally such as ETSI, the IPv6 Forum, Z-Wave Alliance, and Zigbee, IPSO has recently reached an agreement to partner with the IP500 Alliance. "Our rapidly growing worldwide OEM membership all share the vision of the open communication standard of IP (6LoWPAN / IPv6) extending to billions of devices, such as those used in building safety, security and building automation applications.
Cypress Semiconductor Corp. today announced that I-Rocks Technology, Ltd., a leading PC peripherals manufacturer in Taiwan, has selected Cypress’s PRoC™-UI (Programmable Radio-on-a-Chip–User Interface) solution for its RF6496 wireless keyboard with built-in trackpad. PRoC-UI lowers bill-of-materials costs for the keyboard by providing superior touch performance with support for Windows 8 compatible multi-touch gestures along with best-in-class wireless connectivity in a single chip. The RF6496 also employs Cypress’s enCoRe™ V low-voltage companion microcontroller for its mechanical buttons.
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