Based on the Bytewise Profile360 laser system that measures the geometry of extruded profiles, Crosscheck™ uses a high resolution, two dimensional digital camera sensor and a laser to read a profile surface and provide real-time shape measurements for process control, part inspection, robotic guidance and shape checking.
Tamar Technology acquired orders for Through-Silicon Via (TSV) measurement technology, from two main semiconductor equipment producers. The proprietary Wafer Thickness Sensor (WTS) of Tamar can calculate TSVs etch depth and wafer thickness for single or multiple wafers.
NDC Infrared Engineering Ltd, a web-based calibration system manufacturer for extrusion industry, is releasing three novel thickness measurement systems, the re-modeled NIR sensor FG710S, the extended range TFG710S-ER film system and the OptiMike Shadow LED sensor, at the K’2010 exhibition
Rolls-Royce, the leading provider of power systems, has been assigned to upgrade the National Oceanic and Atmospheric Administration (NOAA) ship Thomas Jefferson which is the Moving Vessel Profiler (MVP™) of the NOAA.
SICK, a trend-setter in the production of sensors, machine vision, safety systems and automatic identification products for Factories and Logistics Automation, has introduced a new array sensor named WL27-3 Reflex
Micro-Epsilon has introduced the latest version of the company�s optoNCDT 1402 laser sensor.
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