In a breakthrough for high-definition (HD) network video surveillance, NXP Semiconductors N.V. today announced its Advanced ASC884xA and ASC885xA series of single-chip video processors for HD IP security cameras. These devices integrate virtually all functions required for an IP camera design – from raw image sensor data input, image signal processing (ISP), and H.264 compression, to secure encrypted transmission over the network through a Gigabit Ethernet interface.
ams, has announced that two of its products have been selected as EDN’s “Hot 100 Products for 2012“. The award-winning AS3935 Franklin Sensor IC and the innovative AS3421/3422 ANC (active noise cancellation) ICs have been selected for the “Sensors” and “Microcontrollers and Processors” categories, respectively.
Leading semiconductor test equipment supplier Advantest Corporation has introduced the IC industry's fastest image-capture module to cost-efficiently test the high-frequency, low-power D-PHY and M-PHY interface chips expected to drive growth in the image sensor market. The new T2000 3Gbps CMOS Image Capture Module operates on Advantest's T2000 ISS system, an industry-leading test platform for a broad range of system-on-chip (SoC) devices.
MU9 series industrial cameras offer high-quality monochrome and color 5 Mpix CMOS sensors, USB 2.0 interface, and APIs for more than 30 leading image processing libraries in both subminiature board-level and enclosed camera configurations.
Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, announced a new 13 mega pixel, 1.12 micrometer, CMOS image sensor delivering high-image quality equivalent to a 1.4 micrometer pixel image sensor.
GeneralDynamics Global Imaging Technologies has delivered the1,000th precision-machined beryllium sensor housing to DRSTechnologies, Inc.
A new device invented at the Harvard School of Engineering and Applied Sciences (SEAS) can absorb 99.75% of infrared light that shines on it. When activated, it appears black to infrared cameras.
Ophir Photonics Group, the global leader in precision laser measurement equipment and a Newport Corporation brand, today announced two new Pyroelectric Laser Energy Sensors, the PE50BF-DIFH-C and the PE100BF-DIF-C.
ON Semiconductor, driving innovation in energy efficiency, has collaborated with Teledyne Imaging Sensors to manufacture an Extremely Large Stitched Read Out Integrated Circuit (ELS ROIC) for astronomy. The H4RG-15 image sensor, designed by Teledyne, is the latest generation of a 20-year effort sponsored by the National Science Foundation, the National Aeronautics and Space Administration, and Teledyne internal funding to develop increasingly larger and more powerful infrared sensors for astronomical research.
Researchers at the UPNA-Public University of Navarre develop a technique to improve the capture in real time of three-dimensional images. The work, published in a leading scientific journal on Computation and Artificial Intelligence, has applications in aeronautics, the automotive sector and operating theatres.
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