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IDT’s DDR4 Register and Thermal Sensor Now Available in Volume Sample

Integrated Device Technology has introduced a DDR4 register and temperature sensor in compliance with industry’s stringent performance requirements.

IDT Announces Volume Sample Availability of DDR4 Register and Thermal Sensor for Next-Generation Server Memory Modules

The new products have been created in such a way to facilitate advanced DRAM modules, such as registered dual inline memory modules (RDIMMs) as well as load-reduced DIMMs (LRDIMMs), thereby allowing improvements in server and storage sub-system performance, power efficiency, and scalability.

The IDT 4RCD0124 DDR4 register allows more rapid data rates and reduced operating voltages, integrating significant features that DDR4 server-class memory modules would demand such as support for high-density DRAM technologies, like three-dimensional DRAM stacking (3DS), and advanced reliability, availability and serviceability (RAS) capabilities. Additionally, it enables sideband control of supplementary data buffers. By combining with the register, it creates the basis for DDR4 LRDIMMs providing new level of speed-scalable memory density for virtualized storage and computing systems. DDR4 server memory modules will provide two-fold increase in performance of the existing DDR3 memory modules with up to 3200 MT/s of efficiency with 35 % decrease in power.

The IDT TSE2004GB2 thermal sensor with integrated serial presence detect (SPD) optimizes the IDT developed high-precision low-power thermal sensing technology and improves with rapid SM-Bus access up to 1 MHz and twice the EEPROM memory density at 512 bytes. The device is completely backward-compatible with DDR3 systems and also promotes current feature enhancements for DDR4 systems, established by the Joint Electronic Device Engineering Council (JEDEC).

The IDT 4RCD0124 is available in samples for qualified customers and is being offered in a 253-ball BGA package. Provided in an 8-pin VQFPN package, the IDT TSE2004GB2 is sampling a sample as well.

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